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Home > products > Thermal Conductive Gel > TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink

TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF090-11

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price
Highlight:
Products Name:
TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink
Materail:
Ceramic Filled Silicon Material
Color:
Gray
Application:
Electronic Component Gap Filling
Specific Gravity:
3.45g/cc
Thermal Conductivity:
9.0W/mK
Continuous Use Temperature:
-45~200℃
Keywords:
Thermal Conductive Gel
Products Name:
TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink
Materail:
Ceramic Filled Silicon Material
Color:
Gray
Application:
Electronic Component Gap Filling
Specific Gravity:
3.45g/cc
Thermal Conductivity:
9.0W/mK
Continuous Use Temperature:
-45~200℃
Keywords:
Thermal Conductive Gel
TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink

TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink

 

TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.

 

Feature
> Thermal conductivity: 9.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

 

Application
> Heat-sink & frame
> LED backlight module,LED lighting

> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler

> Telecom industry
> Semiconductor automatic laboratory equipment

TIFTM090-11 Typical Property
Property Value Test method
Color Gray Visual
Construction & Composition Ceramic filled silicon material *****
Viscosity 13000K mPa.s GB/T 10247
Specific Gravity 3.45g/cm³ ASTM D297
Thermal conductivity 9.0 W/mK ASTM D5470
Thermal resistance @10Psi(℃-in²/W) 0.089 ASTM D5470
Thermal resistance @50Psi(℃-in²/W) 0.055 ASTM D5470
Recommended Operating temp -45~200℃ *****
Dielectric breakdown strength(V/mm) ≥4000 ASTM D149
Bond line Thickness 0.4 ******
D3-D10(Siloxane Content, ppm) <100 GC-MS
Flame Rating V-0 UL 94
 

TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink 0

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Q&A

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

 

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

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