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TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

Name: TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF045-01
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF045-01

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

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Product Details

Product Description

Highlight:

Products Name:	High Thermal 6.5W Silicone Thermal Conductive Gel For Gap Filling	Thermal Conductivity:	4.5W/mK
Keywords:	Thermal Gel	Application:	Gap Filling
Specific Gravity:	2.95g/cm³	Continuous Use Temperature:	-45~200℃
Materail:	Ceramic Filled Silicon Material	Color:	Black

Products Name:	High Thermal 6.5W Silicone Thermal Conductive Gel For Gap Filling
Thermal Conductivity:	4.5W/mK
Keywords:	Thermal Gel
Application:	Gap Filling
Specific Gravity:	2.95g/cm³
Continuous Use Temperature:	-45~200℃
Materail:	Ceramic Filled Silicon Material
Color:	Black

TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

TIF045-01 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility.

Due to TIF045-01 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF045-01 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.

TIF045-01 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

Feature
> Thermal conductivity: 4.5W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly

> Proven long-term reliability

Application
> Mass storage devices
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> vihicel enginee controler

> Telecom industry
> Semiconductor automaticlaboratory equipment.

TIF^TM045-01 Typical Properties
Property	Value	Test method
Color	Black	Visual
Construction & Composition	Ceramic filled silicon material	*****
Viscosity	4000K mPa.s	GB/T 10247
Density	2.95g/cm³	ASTM D297
Thermal conductivity	4.5W/mK	ASTM D5470
Thermal diffusivity	1.651 mm²/s	ISO 22007-2
Specific heat capacity	2.7MJ/m³K	ISO 22007-2
Continuous Use Temperature	-45 ~200°C	Ziitek Test Method
Dielectric breakdown strength	200 V/mil	ASTM D149
Flame Rating	94V0	UL E331100

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling 0

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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