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TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe

Name: TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF045-01
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF045-01

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe	Thermal Conductivity:	4.5W/mK
Keywords:	Thermal Gel	Application:	Micro Heat Pipe
Specific Gravity:	3.2g/cm³	Continuous Use Temperature:	-45~200℃
Materail:	Ceramic Filled Silicon Material	Color:	Gray
Shelf Life:	12 Months

Products Name:	TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe
Thermal Conductivity:	4.5W/mK
Keywords:	Thermal Gel
Application:	Micro Heat Pipe
Specific Gravity:	3.2g/cm³
Continuous Use Temperature:	-45~200℃
Materail:	Ceramic Filled Silicon Material
Color:	Gray
Shelf Life:	12 Months

TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe

TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe

Products description

TIF045-11 is a soft silicone gel-based gap filler pad,formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF045-11 has a higher viscosity, which effectively prevents filer separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting. and other high-power electronic components.

Feature

>Thermal conductivity: 4.5 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF^®045-11 Typical Properties
Property	Value	Test method
Color	Gray	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	40	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	40	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.20g/c	ASTM D297
Thermal conductivity	4.5W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.077	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.068	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.2	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe 0

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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