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Home > products > Thermal Conductive Gel > TIF040-49 High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment

TIF040-49 High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF040-49

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube,50cc/pcs, 300cc/pcs

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

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Highlight:
Products Name:
High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment
Keywords:
Thermal Conductive Gel
Color:
Pink
Application:
Semiconductor Automatic Laboratory Equipment
Density:
3.15 G/cm³
Thermal Conductivity:
4.0W/mK
Recommended Operating Temperature (℃):
-40~200℃
Materail:
Ceramic Filled Silicon Material
Products Name:
High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment
Keywords:
Thermal Conductive Gel
Color:
Pink
Application:
Semiconductor Automatic Laboratory Equipment
Density:
3.15 G/cm³
Thermal Conductivity:
4.0W/mK
Recommended Operating Temperature (℃):
-40~200℃
Materail:
Ceramic Filled Silicon Material
TIF040-49 High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment

High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment


Products description

TIF®040-49 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity,which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Feature

>High Thermal conductivity
>Soft, very low compression
>Ultra thin interface
>Operate automatically
>Long-term reliability

Application

>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Automobile engine control device
>Telecom industry
>Semiconductor automatic testing equipment

Technical Specifications of TIF®️040-49 Series

Property Value Test Method
Color Pink Visual
Construction Ceramic filled silicon material ZKTM J024
Flow Rate (g/min)
(30cc syringe/ 2.5mm orifice/90 psi)
130 ZKTM B014
Density (g/cm³) 3.15 ASTM D792
Thermal conductivity (W/mK) 4.0 ASTM D5470
Thermal impedance (℃-in²/W) @10psi 0.109 ASTM D5470
Thermal impedance (℃-in²/W) @50psi 0.093 ASTM D5470
Recommended Operating Temperature -40~200℃ ZKTM J025
Breakdown Strength (V/mm) ≥1500 ASTM D149
Bond Line Thickness (mm) 0.13 ZKTM B047
Flame Rating V-0 UL 94
Volatility Loss (%) @150°C, 24 hrs <1 HG/T 2502

Product Specifications

30cc/pcs, 50cc/pcs, 300 cc/pc, or custom packaging for automated applications.

For more information about thermal conductive materials, please contact our company.

 

TIF040-49 High Performance Thermal Gel With Low Compression For Semiconductor Automatic Laboratory Equipment

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

FAQ:

 

Q:What is Thermal Gel?
A: Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.

 

Q:What is the main advantage of Thermal Gel?
Answer: The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.

 

Q:What size gap (Gap) is Thermal Gel suitable for?
A: The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.

 

Q:Will Thermal Gel flow or leak?
A: Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.

 

Q:Does Thermal Gel need to be cured?
A: It depends on the product type. Some thermal gels are non-curing, while others are designed to cure after application. The appropriate type should be selected according to the customer's production process and operating environment.

 

Q:What is the difference between Thermal Gel and Thermal Grease?
A:Thermal gel generally provides better gap-filling and shape-retention capabilities, while thermal grease is primarily used for very thin interface layers. The appropriate choice depends on the required gap, assembly conditions, and long-term reliability requirements.

 

Q: Can Thermal Gel be used in battery packs?
A: Yes. Thermal gel can be applied between battery cells, modules, cooling structures, and other components requiring thermal management. The selected product should meet the battery pack's requirements for electrical insulation, flame resistance, temperature resistance, and long-term reliability.

 

Q: Is Thermal Gel suitable for AI servers?
A: Yes. For GPUs, CPUs, power components, and other components with significant height differences or complex structures, thermal gel provides excellent gap-filling capability and can help improve thermal transfer.

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