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Home > Products > Thermal Conductive Gel > TIF030AB-05R Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics

TIF030AB-05R Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF030AB-05R

Payment & Shipping Terms

Minimum Order Quantity: 1000 pcs

Price: 0.1-10 USD/PCS

Packaging Details: 25*14*13cm carton

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/month

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Highlight:
Products Name:
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics
Thermal Conductivity:
3.0W/mK
Keywords:
Thermal Conductive Gel
Hardness:
50 Shore 00
Density:
3.1g/cm³
Recommended Operating Temperature (°C):
-40~200℃
Color:
White / Blue
Application:
For Heat Transfer In Automotive Electronics
Products Name:
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics
Thermal Conductivity:
3.0W/mK
Keywords:
Thermal Conductive Gel
Hardness:
50 Shore 00
Density:
3.1g/cm³
Recommended Operating Temperature (°C):
-40~200℃
Color:
White / Blue
Application:
For Heat Transfer In Automotive Electronics
TIF030AB-05R Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics

Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics​

 

 Products description

 

TIF®030AB-05R is a two-component liquid gap filler material, featuring high thermal conductivity,low thermal resistance, excellent electrical insulation, and high temperature aging resistance. After curing, its performance is equivalent to that of thermal conductive silicone rubber sheets, making it suitable for low stress and high compression modulus scenarios. The cured adhesive layer also exhibits good pluggability, facilitating easy separation during RMA (Repair, Maintenance, and Assembly) without damaging the equipment, effectively reducing the dificulty of repair and the cost of scrap.

 

Feature

 

> High thermal conductivity
> Two-part formulation for easy storage
> Excellent low and high temperature mechanical and chemical stability
> Ultra-conforming low-stress interface application
> Easy to remove for RMA rework, no substrate damage

 

Applications
 

> Computer and peripherals
> Telecommunications
> Automotive electronics
> Thermally conductive vibration dampening
> Heat sink and any heat generating semicondutor

 

Typical Properties of TIF®030AB-05R Series
Uncured Material Properties
Property Value Test Method
Construction Ceramic filled silicon material -
Color/Part A White Visual
Color/Part B Blue Visual
Flow Rate(g/min) 25 Ziitek Test Method
(50 cc syringei/1.5 mm orifice/90 psi)
Bond Line Thickness (mm) 0.15 -
Thermal Resistance (℃·in²/W) @10psi 0.09 ASTM D5470
Thermal Resistance (℃·in²/W) @50psi 0.08 ASTM D5470
Mix Ratio 1:1 -
Cure Schedule
Cure @25℃ 45 min Ziitek Test Method
Cure @70℃ 10 min Ziitek Test Method
Cure Material Properties
Color Blue Visual
Hardness (Shore 00) 50 ASTM D2240
Density (g/cm³) 3.1 ASTM D792
Thermal Conductivity(W/mK) 3.0 ASTM D5470
Breakdown Strength (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-cm) >1.0x1011 ASTM D257
Recommended Operating Temperature (°C) -40~200℃ -
Flame Rating V-0 UL 94
 

Product packing details:

 

50 cc/pcs, 400 cc/pcs, or customized packaging for automation applications.
For more information about thermal conductive materials, please contact our company.

TIF030AB-05R Thermal Conductive Gel Two Parts Liquid Gap Filling Material With High Thermal Conductivity For Heat Transfer In Automotive Electronics

Company Profile

 

Vietnam Ziitek Technology Company Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ

 

Q: Are you trading company or manufacturer?

A: We are manufacturer in Vietnam.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: What are thermal pads used for?

A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.

 

Q: Is a thermal pad effective?

A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate. 

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