Products

Home > Products > Thermal Conductive Gel > TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

Catagories

Thermal Conductive Silicone Glue

(12)

Thermal Conductive Epoxy Adhesive

(5)

Silicone Foam Gasket

(8)

Contacts

Contacts: Ms. Sophia

Tel: +86 181 5378 1280

Contact Now

Mail Us

TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

Name: TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF030AB-WA
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF030AB-WA

Payment & Shipping Terms

Minimum Order Quantity: 1000 pcs

Price: 0.1-10 USD/PCS

Packaging Details: 25*24*13cm canton

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/month

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards	Thermal Conductivity:	3.0W/mK
Keywords:	Thermally Conductive Wave Absorbing Gel	Application:	For Power Modules And Industrial Control Motherboards
Density:	4.0g/cm³	Recommended Operating Temperature:	-40~200℃
Color:	Gray	Hardness:	60 Shore 00

Products Name:	Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards
Thermal Conductivity:	3.0W/mK
Keywords:	Thermally Conductive Wave Absorbing Gel
Application:	For Power Modules And Industrial Control Motherboards
Density:	4.0g/cm³
Recommended Operating Temperature:	-40~200℃
Color:	Gray
Hardness:	60 Shore 00

TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

TIF^®030AB-WA is a two-component thermally conductive and wave-absorbing gel designed for high-performance equipment. It delivers excellent EMl suppression while boasting superior thermal conductivity, making it ideal for applications requiringsimultaneous electromagnetic interference absorption and heat dissipation. Its gel form ensures exceptional application flexibility and gap adaptability, along with outstanding compressibility and conformability. The product is compatible withlarge-scale, automated dispensing processes, and is especially suitable for irregular surfaces and gap scenarios.

Features

>Integrated thermal conductivity and wave absorption dual functions
>Highly flexible silicone gel material
>High-viscosity stable system, no filler migration
>Easy for automated operation of dispensing systems
>Long-term reliability

Applications

>RF modules for Routers/ Switches
>RF chips in smartphones,Tablets and Laptops
>Battery management system for new energy vehicles
>Power modules and Industrial control motherboards
>Lasers, Sensors and High-speed transmission interfaces

Typical Properties of TIF^®030AB-WA
Uncured Material Properties
Property	Value	Test Method
Construction	Ceramic and magnetic powder-filled silicone materials	-
Color/Part A	Gray	Visual
Color/Part B	Gray	Visual
Part A Viscosity (mPa·s)	7,000,000	GB/T 10247
Part B Viscosity (mPa·s)	7,000,000	GB/T 10247
Bond Line Thickness (mm)	0.1	-
Mix Ratio	1:1	-
Shelf Life(Month)	12(Unopened)	-
Cure Schedule
Pot Life @25℃	30 mins	Ziitek Test Method
Cure @25℃	2-4 hours	Ziitek Test Method
Cure @70℃	30 mins	Ziitek Test Method
Cure Material Properties
Color	Gray	Visual
Hardness (Shore 00)	60	ASTM D2240
Density(g/cm³)	4.0	ASTM D792
Thermal Resistance @10psi (℃·in²/W)	0.08	ASTM D5470
Thermal Resistance @50psi (℃·in²/W)	0.07	ASTM D5470
Thermal Conductivity (W/Mk)	3.0	ASTM D5470
Recommended Operating Temperature (°C)	-40~200℃	-
Flame Rating	V-0	UL 94

TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

Product Specification:

50cc/pcs, 400cc/pcs,or customized packaging for automation applications.

For information on products of different specifications, please contact our company.
If you want to learn more about our thermal conductivity products, please visit our official website.

TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Tags:

TIF015AB-07S Thermal Conductive Liquid Gap Filler Silicon Gel Electreics Thermally Conductive Gel For CPU COB Computer Laptop

Get Best Price

Video

Thermal Pad

Thermal Grease

Phase Changing Materials

Thermal Insulation Materials

Thermal Graphite Sheet

Thermal Adhesive Tape

Thermal Conductive Silicone Glue

Thermal Conductive Gel

Thermal Conductive Epoxy Adhesive

Thermal Conductive Plastic

Silicone Free Thermal Pad

EMI Absorber

Silicone Foam Gasket

TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards

TIF015AB-07S Thermal Conductive Liquid Gap Filler Silicon Gel Electreics Thermally Conductive Gel For CPU COB Computer Laptop

TIF050AB-11S Two Component 5.0W/M-K Silicone Thermal Gel For Aerospace Electronic Equipment

TIF080-11 Gray Excellent Thermal Conductivity 8.0W Thermal Conductive Gel For Telecom Industry

TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink

TIF050-11-1 Thermal Conductive Silicone Gel For Electronic Components

TIF070-11 7.0W/M-K Single-Component Insulation Silicone Conductive Thermal Gel For Telecom Industry

TIF060-16 Purple Silicone Thermal Gel For CPU

TIF050-11 Thermal Conductive Gel Gray 5.0W Single Component For Power Module Base

TIF045-11 High Thermal 4.5W Silicone Thermal Conductive Gel For Micro Heat Pipe

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

Thermal Pad

Thermal Grease

Phase Changing Materials

Thermal Insulation Materials

Thermal Graphite Sheet

Thermal Adhesive Tape

Thermal Conductive Silicone Glue